The Q61SP is Mitsubishi Electric’s slim, low-profile power supply module for the MELSEC-Q programmable controller series, providing 3 A at 5 VDC from a 100–240 VAC universal input in a reduced-depth housing that occupies less panel depth than the standard Q61P and Q64P power supply modules. Designed specifically for installations where panel depth is constrained — such as shallow-depth enclosures, machine-mounted junction boxes, and retrofit applications where the original panel was designed for a narrower power supply profile — the Q61SP delivers the same wide input voltage range as the Q64P while halving the output current capacity to achieve its compact form factor. Available now at Atlantech Drives with worldwide express delivery and 12-month warranty — complete our quote form for pricing and availability.
What Is the Q61SP?
The Q61SP is a slim-profile variant of the MELSEC-Q power supply module family, occupying the dedicated power supply slot of any MELSEC-Q main base unit and providing regulated 5 VDC power to the base unit’s internal bus. Its key differentiator from the standard Q61P, Q62P, Q63P, and Q64P power supply modules is its reduced module depth — the Q61SP protrudes less from the base unit front face, reducing the minimum required panel depth for the complete MELSEC-Q assembly. This makes the Q61SP the preferred choice for panel builders working with IP65 or IP67 enclosures where internal depth is restricted, or for machine builders integrating MELSEC-Q systems into machinery with limited electrical cabinet space. The Q61SP’s 3 A output capacity is sufficient for small to medium MELSEC-Q configurations and is compatible with all MELSEC-Q main base units (Q33B through Q312B).
Key Technical Specifications
- Model: Q61SP
- Output Voltage: 5 VDC
- Output Current: 3 A (maximum)
- Input Voltage Range: 100 to 240 VAC (universal, auto-ranging)
- Input Frequency: 50/60 Hz
- Power Consumption: 60 W maximum
- Profile: Slim (reduced depth compared to Q61P/Q64P)
- Overcurrent Protection: Yes
- Overvoltage Protection: Yes
- Operating Temperature: 0°C to 55°C
- Compatible Base Units: All MELSEC-Q main base units
- Weight: Approx. 0.30 kg
Typical Industrial Applications
The Q61SP is most commonly specified in compact MELSEC-Q systems where the total module current draw is predictably low and panel depth is a hard constraint. Typical applications include machine-mounted control units in the food processing industry where the electrical enclosure must fit within the machine’s external profile, automated guided vehicle (AGV) control systems where the onboard electrical cabinet has a fixed shallow depth, and retrofit installations in legacy machine tools where the original electrical cabinet was designed for a narrower PLC system and increasing the cabinet depth is not feasible. In these scenarios, the Q61SP’s reduced depth can make the difference between a MELSEC-Q system fitting within the available space without panel modifications, and requiring expensive enclosure replacement. For systems using three or fewer peripheral modules with typical digital I/O (QX41, QY41P) and one communication module, the Q61SP’s 3 A output is consistently sufficient — the current draw of three QX41 modules plus one QJ61BT11N CC-Link module totals approximately 0.75 A, well within the 3 A limit.
Replacement & Upgrade Notes
The Q61SP is the recommended replacement for the legacy Q61P-A1S slim power supply adapter used in MELSEC-AnS to MELSEC-Q migration projects where the AnS system’s original slim power supply footprint must be maintained. When replacing a Q62P (3 A standard depth) with a Q61SP in an existing installation where panel depth has become constrained, no changes to the base unit, CPU module, or peripheral modules are required — the Q61SP fits the same power supply slot and provides identical 3 A output capacity. However, if the existing system’s total module current draw exceeds 3 A (which may occur if high-current modules such as QD75MH positioning modules or multiple QJ71LP21-25 MELSECNET modules are installed), the Q61SP cannot be used as a direct replacement and the standard-depth Q64P (6 A) must be retained. Always recalculate the total 5 VDC current demand before substituting a lower-current power supply module in an existing system.
Frequently Asked Questions
Q: How much less depth does the Q61SP occupy compared to the standard Q61P?
A: The Q61SP’s slim profile reduces module depth by approximately 20 mm compared to the standard Q61P. Exact dimensions are provided in the MELSEC-Q Hardware Manual — consult the dimensional drawings for both models before finalising enclosure selection, as the depth savings may affect DIN rail clearance requirements and cable bend radius space behind the modules.
Q: Can the Q61SP power a Q68B base unit with all eight slots populated?
A: Only if the total 5 VDC current draw of all eight modules does not exceed 3 A. For a Q68B with eight standard digital I/O modules (QX41 or QY41P at approximately 0.15–0.16 A each), the total draw is approximately 1.24 A — within the Q61SP’s capacity. However, if the configuration includes higher-current modules such as QD75MH4 (0.50 A), QJ71LP21-25 (0.60 A), or multiple analogue modules, the 3 A limit may be exceeded and the Q64P (6 A) should be specified instead.
Q: Does the Q61SP’s slim profile affect its thermal performance in high-ambient-temperature environments?
A: Yes, to a limited extent. The Q61SP’s reduced physical volume means less thermal mass and a smaller heatsink surface area compared to the Q64P. Mitsubishi rates both modules for operation up to 55°C ambient, but in installations where the ambient temperature regularly approaches 50–55°C, the Q64P’s larger thermal mass provides greater operating margin. For high-temperature environments above 45°C ambient with a fully loaded 3 A output, monitor the Q61SP’s operating temperature using the MELSEC-Q system monitor in GX Works2 to ensure the module remains within its rated thermal envelope.
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